Addition of Cobalt Nanoparticles into Sn-3.8Ag- 0.7Cu Lead-Free Solder by Paste Mixing

HASEEB, A.S. MD. ABDUL (2011) Addition of Cobalt Nanoparticles into Sn-3.8Ag- 0.7Cu Lead-Free Solder by Paste Mixing. Soldering & Surface Mount Technology.

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Abstract

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Item Type: Article
Uncontrolled Keywords: Addition of Cobalt Nanoparticles into Sn-3.8Ag- 0.7Cu Lead-Free Solder by Paste Mixing
Subjects: University Structure > Faculty of Engineering, Science and Mathematics > School of Engineering Sciences
Depositing User: MR. ADNAN YAHYA
Date Deposited: 23 Feb 2011
Last Modified: 23 Feb 2011
URI: http://repository.um.edu.my/id/eprint/10041

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