Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging

HASEEB, A.S. MD. ABDUL (2015) Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging. J Materials Science: Materials in Electronics, 26 (1). pp. 294-299.

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Abstract

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Item Type: Article
Uncontrolled Keywords: Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during roo
Subjects: University Structure > Faculty of Engineering, Science and Mathematics > School of Engineering Sciences
Depositing User: MR. ADNAN YAHYA
Date Deposited: 29 Dec 2015
Last Modified: 08 Jan 2016
URI: http://repository.um.edu.my/id/eprint/109356

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