Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame.

Haseeb, A. S. M. A. and H., Haque A.; Lim B. H.; Haseeb A. S. M. A.; Masjuki,H. (2012) Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame. Journal of Materials Science: Materials in Electronics, 23 (1). pp. 115-123.

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Abstract

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Item Type: Article
Uncontrolled Keywords: Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame.
Subjects: University Structure > Faculty of Engineering, Science and Mathematics > School of Engineering Sciences
Depositing User: MR. ADNAN YAHYA
Date Deposited: 16 Feb 2012
Last Modified: 01 Jun 2012
URI: http://repository.um.edu.my/id/eprint/18307

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