Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

A.S.M.A.Haseeb, A.S.M.A.Haseeb and Johan, Mohd Rafie and Tay, S. L. (2011) Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing. Soldering and Surface Mount Technology, 23 (1). pp. 10-14.

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Item Type: Article
Uncontrolled Keywords: Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
Subjects: University Structure > Faculty of Engineering, Science and Mathematics > School of Engineering Sciences
Depositing User: MR. ADNAN YAHYA
Date Deposited: 20 Nov 2012
Last Modified: 20 Nov 2012
URI: http://repository.um.edu.my/id/eprint/27246

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