Surface Morphology and Electrical Properties of Pulse Electrodeposition of NiFe Films on Copper Substrates in Ultrasonic Field

HOONG, OI BOON HONG @ ONG BOON (2011) Surface Morphology and Electrical Properties of Pulse Electrodeposition of NiFe Films on Copper Substrates in Ultrasonic Field. International Journal of Electrochemical Science, 6. pp. 3564-3579.

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Item Type: Article
Uncontrolled Keywords: Surface Morphology and Electrical Properties of Pulse Electrodeposition of NiFe Films on Copper Sub
Subjects: Q Science
Depositing User: MR. ADNAN YAHYA
Date Deposited: 19 Mar 2014
Last Modified: 19 Mar 2014
URI: http://repository.um.edu.my/id/eprint/37500

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