The effects of wire geometry and wire layout on wire sweep performance using LQFP packages in transfer mold

CHIN, ANG BEE (2014) The effects of wire geometry and wire layout on wire sweep performance using LQFP packages in transfer mold. International Journal of Precision Engineering and Manufacturing, 15.

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Item Type: Article
Uncontrolled Keywords: The effects of wire geometry and wire layout on wire sweep performance using LQFP packages in transf
Subjects: University Structure > Faculty of Engineering, Science and Mathematics > School of Engineering Sciences
Depositing User: MR. ADNAN YAHYA
Date Deposited: 31 Mar 2015
Last Modified: 31 Mar 2015
URI: http://repository.um.edu.my/id/eprint/98695

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